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ANIONIC CURABLE COMPOSITIONS

The present invention provides compositions, including die attach adhesives, coatings and underfill materials, which are useful in electronics packaging and the composite fields. Specifically, the invention provides liquid and very low melting epoxy-maleimide compositions that co-cure upon the addition of an anionic cure catalyst in the absence of any other cure catalyst.


» Number: US2018237668A1 (A1)

» Publication Date: 18//2/23/0

» Applicant: DESIGNER MOLECULES INC?[US]

» Inventor: MIZORI FARHAD G?[US]

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This project has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement n° [609149].

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